JPH0481849B2 - - Google Patents
Info
- Publication number
- JPH0481849B2 JPH0481849B2 JP59199284A JP19928484A JPH0481849B2 JP H0481849 B2 JPH0481849 B2 JP H0481849B2 JP 59199284 A JP59199284 A JP 59199284A JP 19928484 A JP19928484 A JP 19928484A JP H0481849 B2 JPH0481849 B2 JP H0481849B2
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- plate
- resin material
- cover sheet
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 67
- 229920005989 resin Polymers 0.000 claims description 67
- 239000000463 material Substances 0.000 claims description 36
- 230000007246 mechanism Effects 0.000 claims description 36
- 238000010438 heat treatment Methods 0.000 claims description 30
- 238000004804 winding Methods 0.000 claims description 11
- 239000002184 metal Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 5
- 239000006082 mold release agent Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Laminated Bodies (AREA)
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59199284A JPS6177320A (ja) | 1984-09-21 | 1984-09-21 | 電子機構部品の開口にカバ−シ−トを形成するための装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59199284A JPS6177320A (ja) | 1984-09-21 | 1984-09-21 | 電子機構部品の開口にカバ−シ−トを形成するための装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6177320A JPS6177320A (ja) | 1986-04-19 |
| JPH0481849B2 true JPH0481849B2 (en]) | 1992-12-25 |
Family
ID=16405234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59199284A Granted JPS6177320A (ja) | 1984-09-21 | 1984-09-21 | 電子機構部品の開口にカバ−シ−トを形成するための装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6177320A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6327003U (en]) * | 1986-08-05 | 1988-02-22 | ||
| US11792911B2 (en) | 2021-06-17 | 2023-10-17 | International Business Machines Corporation | Flexible cold plate for contacting varied and variable chip heights |
-
1984
- 1984-09-21 JP JP59199284A patent/JPS6177320A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6177320A (ja) | 1986-04-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |